2023年3期
刊物介紹
本刊供我國高技術(shù)研究人員及時(shí)發(fā)表其研究成果和進(jìn)行國內(nèi)、國際學(xué)術(shù)交流的園地，旨在促進(jìn)我國高技術(shù)研究的發(fā)展和擴(kuò)大其在國內(nèi)外的影響。內(nèi)容涉及生物、計(jì)算機(jī)、電子與光電子技術(shù)、現(xiàn)代通訊、自動(dòng)化、機(jī)器人能源、新材料、海洋及其它高技術(shù)領(lǐng)域，主要讀者對(duì)象是科研院所研究人員、科技管理人員、大專院校師生及大中型企業(yè)科研人員。
High Technology Letters
- Joint UAV 3D deployment and sensor power allocation for energy-efficient and secure data collection①
- Research and experimental analysis of precision degradation method based on the ball screw mechanism①
- In-flight deformation measurement for high-aspect-ratio wing based on 3D speckle correlation①
- Semantic-aware graph convolution network on multi-hop paths for link prediction①
- A greedy path planning algorithm based on pre-path-planning and real-time-conflict for multiple automated guided vehicles in large-scale outdoor scenarios①
- Design of two-dimensional spatially coupled LDPC codes for combating burst erasures①
- Deep reinforcement learning based task offloading in blockchain enabled smart city①
- The relationship between extra connectivity and t/k-diagnosability under the PMC model①
- Research on system combination of machine translation based on Transformer①
- A wireless geophone based on STM32①
- End-to-end aspect category sentiment analysis based on type graph convolutional networks①
- Experimental study on the failure factors of the O-ring for long-term working①