李國(guó)杰 范東睿
摘 要:體系結(jié)構(gòu)面對(duì)很多挑戰(zhàn),例如微結(jié)構(gòu)設(shè)計(jì),片上資源管理,測(cè)試驗(yàn)證設(shè)計(jì)等。在這個(gè)項(xiàng)目中,為了解決如上這些挑戰(zhàn),做如下3方面的研究:(1)高通量計(jì)算應(yīng)用的可擴(kuò)展眾核處理器結(jié)構(gòu)研究;(2)高效能片上資源管理和控制;(3)納米級(jí)高通量眾核處理器芯片設(shè)計(jì)、測(cè)試和驗(yàn)證。
關(guān)鍵詞:任務(wù)書 高通量 微結(jié)構(gòu)
Abstract:architecture facing many challenges, such as microarchitecture design, on-chip resource management, design for testability and verification, et. al. To solve these challenges as listed, in this subproject, we do three kinds of research on: 1) Scalable microarchitecture of manycore processor for high throughput computing with huge applications, 2) high energy efficiency on-chip resource management and control, and 3) high throughput manycore processor chip design, test and verification with nanometer technology.
Key Words:Proposal;High-throughput;Mircorarchitecture;973
閱讀全文鏈接(需實(shí)名注冊(cè)):http://www.nstrs.cn/xiangxiBG.aspx?id=50780&flag=1